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Phased Array Antennas

Phased Arrays in Radar and Communication Systems: System requirements for radar and communication antennas, Array characterization for radar and communication systems, Fundamental results from array theory, Array size determination, Time-delay compression. Pattern characteristics of Linear and Planar Arrays: Array analysis, characteristics of linear and planer arrays, scanning to end fire, Thinned arrays. Pattern Synthesis for Linear and Planar Arrays: Linear arrays and planar arrays with separable distributions, circular planar arrays and adaptive arrays.

Adaptive and Smart Antennas

Adaptive Array Concept: Motivation of using Adaptive Arrays, Adaptive Array problem statement, Signal Environment, Array Element Spacing considerations, Array Performance, Nulling Limitations due to miscellaneous array effects, Narrow band and broad band signal processing considerations Optimum Array Processing: Steady state performance limits and the Wiener solution, Mathematical Preliminaries, Signal Description for conventional and signal aligned arrays, Optimum Array Processing for narrowband applications, Optimum Array Processing for broadband applications, Optimum Array Processing for

RF Packaging and Electromagnetic Compatibility

EMC Requirements for Electronic Systems: Sources of EMI; Aspects of EMC; Radiated susceptibility; Conducted susceptibility; Electrostatic discharge; Design constraints for products; Advantages of EMC design; Transmission line per-unit-length parameters: Wire type structures, PCB structures; High-speed digital interconnects and signal integrity. Non-ideal Behavior of Components: Spurious effects of wires, PCB, component leads, resistors, capacitors, inductors, ferromagnetic materials, electromagnetic devices, MMIC components, digital circuit devices, and mechanical switches.

RF IC and Microwave MEMS

Intro to MMIC, Processing & Layers, Passive MMIC Elements & Models, Active MMIC Elements & Models Biasing, Amplifiers.

Introduction to MMICs. Technologies: GaAs/Si/InP: MESFET HEMT BJT HBT. Applications, Circuit basics. Fabrication Technology. MMIC components, Active devices, Passive lumped elements, Micro strip elements.

Introduction: RF MEMS for microwave applications, MEMS technology and fabrication, mechanical modelling of MEMS devices, MEMS materials and fabrication techniques.

Project Work Phase II

  • In Phase-II, students are supposed to show the full work including the work done in Phase-I
  • Multiple intermediate review meeting during the semester can be called by the supervisor and the course-coordinator
  • A report in the prescribed format on the literature survey, theoretical analysis, design guidelines, simulation, development of the prototype and experimental characterization etc.

Project Work Phase I

  • In Phase-I, students are supposed to show a progress report at the semester end.
  • Multiple intermediate review meetings can be called by the supervisor and the course- coordinator.
  • A report in the prescribed format on the literature survey, theoretical analysis, design guidelines, simulation, and experimental results, etc., is to be submitted to the committee.
  • Final evaluation is done based on the supervisor’s mark, work done, presentation, and interaction.

Seminar

1. Presentation (Topic to be chosen by students based on the options offered by the faculty members)

2. Contact Hours (24 HRS) [Faculty Interaction]

3. Seminar-II should be aimed for a detailed literature survey for 3rd and 4th Sem projects.

4. Students should concentrate on literatures, some designs analysis, calculations etc. and present a consolidated report to the panel.

5. Preparation of Report.

6. Evaluation is based on the presentation and report submission.

Event Details

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