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Power semiconductor devices

Introduction to Power Semiconductor devices, Device Basic Structure and Characteristics, High current effects in diodes, Breakdown considerations for various devices, Schottky rectifiers. - P- i-N rectifiers Power BJTs, Parasitics in Power Transistors, Power MOSFETs, Thyristors, Power Insulated Gate Transistors, Heat transfer in power devices, device packaging

VLSI Digital Signal Processing

Introduction to Digital Signal Processing; Need of VLSI DSP algorithms. main DSP Blocks and typical DSP Algorithms. Number Representation: Fixed point Representation Floating point Representation; Binary Adders; Binary Multiplier; Binary Dividers; Floating point Arithmetic Implementation: CORDIC architectures; Multiply Accumulator unit; Computation of Special functions using MAC cells. Redundant arithmetic, redundant number representations, carry free radix 2 addition and subtraction. Hybrid radix 4 addition. Radix 2 hybrid redundant multiplication architectures, data format conversion.

Sensors and Actuators

Introduction and historical background, Microsensors : Sensors and characteristics, Integrated Smart sensors, Sensor Principles/classification-Physical sensors ( Thermal sensors, Electrical Sensors, tactile sensors, accelerometers, gyroscopes , Proximity sensors, Angular displacement sensors, Rotational measurement sensors, pressure sensors, Flow sensors, MEMS microphones etc.), Chemical and Biological sensors (chemical sensors, molecule-based biosensors, cell- based biosensors), transduction methods(Optical, Electrostatic, Electromagnetic, Capacitive, Piezoelectric, piezo resistive etc.),

RF MEMS

Introduction to RF MEMS, Electrical and mechanical modelling of MEMS devices, MEMS Switches: Introduction to MEMS switches; Capacitive shunt and series switches: Physical description, circuit model and electromagnetic modelling; Techniques of MEMS switch fabrication and packaging; Design of MEMS switches. RF Filters and Phase Shifters: Modeling of mechanical filters, micro machined filters, surface acoustic wave filters, micro machined filters for millimeter wave frequencies; Various types of MEMS phase shifters; Ferroelectric phase shifters.

RF Integrated Circuits

On-chip RF passive components, resonant circuits, matching circuits. Noise – source, modelling, noise figure, noise temperature, noise figure of cascaded systems. Linearity – HD, IMD, IP2, IP3. ACLR, AACLR. Basics of wireless communication. LNA design, Input matching for power, input matching for noise. Advanced LNA circuits. Mixer topologies – active and passive. Receiver architectures. Voltage controlled oscillator topologies – theory and design, phase noise. Phase locked loops (PLL) – theory, design of individual elements and the complete system.

Microsystem Integration

MEMS Foundry processes, CMOS-MEMS Integration: Design and technology, Bonding & Packaging of MEMS, MEMS reliability, non-silicon MEMS, Interface electronics for sense and drive in microsystems, MEMS and circuit noise sources, Noise and Offset Cancellation Technique, testing and calibration approaches in integrated microsystems. MEMS Sensors and Actuators: Case Studies (Mechanical, Inertial, bio/chemical, Microfluidics, RF Applications.); Future Directions and developments (Integrated Nano- Electro-Mechanical Systems (NEMS), NEMS oscillators and sensors)

Mixed Signal VLSI Design

Basics of data conversion systems. Sampling theory. Sample and hold circuits. Linearity, noise in mixed signal systems. Comparator design. Preamplifier design. Offset – source, analysis, offset cancellation. ADC topologies – comparative study and analysis. Analysis and design of multiple DAC architectures. Deriving opamp specifications from system level requirements. Non- idealities in ADCs and DACs and compensation techniques. Impact of layout parasitics on the performance of ADCs and DACs. Introduction to high-speed wireline communication circuits.

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