Material Science: introduction, structure, defects, bonds and bands, thermodynamics of material, kinetics, nucleation.

Thin film nucleation: Atomic view of substrate surfaces, thermodynamic aspects of Nucleation, Kinetic processes in Nucleation and growth.

Epitaxy: Lattice mismatch and defects in epitaxial film, epitaxy of compound semiconductors, High and low temp. methods of deposition.

Introduction and historical background, Microsensors : Sensors and characteristics, Integrated Smart sensors, Sensor Principles/classification-Physical sensors ( Thermal sensors, Electrical Sensors, tactile sensors, accelerometers, gyroscopes , Proximity sensors, Angular displacement sensors, Rotational measurement sensors, pressure sensors, Flow sensors, MEMS microphones etc.), Chemical and Biological sensors (chemical sensors, molecule-based biosensors, cell- based biosensors), transduction methods(Optical, Electrostatic, Electromagnetic, Capacitive, Piezoelectric, piezo resistive etc.),

Introduction to RF MEMS, Electrical and mechanical modelling of MEMS devices, MEMS Switches: Introduction to MEMS switches; Capacitive shunt and series switches: Physical description, circuit model and electromagnetic modelling; Techniques of MEMS switch fabrication and packaging; Design of MEMS switches. RF Filters and Phase Shifters: Modeling of mechanical filters, micro machined filters, surface acoustic wave filters, micro machined filters for millimeter wave frequencies; Various types of MEMS phase shifters; Ferroelectric phase shifters.

On-chip RF passive components, resonant circuits, matching circuits. Noise – source, modelling, noise figure, noise temperature, noise figure of cascaded systems. Linearity – HD, IMD, IP2, IP3. ACLR, AACLR. Basics of wireless communication. LNA design, Input matching for power, input matching for noise. Advanced LNA circuits. Mixer topologies – active and passive. Receiver architectures. Voltage controlled oscillator topologies – theory and design, phase noise. Phase locked loops (PLL) – theory, design of individual elements and the complete system.

MEMS Foundry processes, CMOS-MEMS Integration: Design and technology, Bonding & Packaging of MEMS, MEMS reliability, non-silicon MEMS, Interface electronics for sense and drive in microsystems, MEMS and circuit noise sources, Noise and Offset Cancellation Technique, testing and calibration approaches in integrated microsystems. MEMS Sensors and Actuators: Case Studies (Mechanical, Inertial, bio/chemical, Microfluidics, RF Applications.); Future Directions and developments (Integrated Nano- Electro-Mechanical Systems (NEMS), NEMS oscillators and sensors)

This nano electronics course provides an introduction to more advanced topics, including the Non- Equilibrium Green’s Function (NEGF) method widely used to analyse quantum transport in nanoscale devices.

Basics of data conversion systems. Sampling theory. Sample and hold circuits. Linearity, noise in mixed signal systems. Comparator design. Preamplifier design. Offset – source, analysis, offset cancellation. ADC topologies – comparative study and analysis. Analysis and design of multiple DAC architectures. Deriving opamp specifications from system level requirements. Non- idealities in ADCs and DACs and compensation techniques. Impact of layout parasitics on the performance of ADCs and DACs. Introduction to high-speed wireline communication circuits.

Design and develop initial design concepts and architectures that are in the area of VLSI and Microsystems using VLSI/CAD design tools based on a set of practical specifications.

Analysis of VLSI circuits and microsystems and efficacy determination with the help of simulation tools.

The layout and test plans/mask layout for hardware verification/fabrication of the simulated system/device