Classical scaling in CMOS, Moore’s law, clean room concept, material properties, crystal structure, lattice, growth of single crystal Si, cleaning and etching, thermal oxidation, dopant diffusion in silicon, deposition & growth (PVD, CVD, ALD, epitaxy, MBE, ALCVD etc.), ion- implantation, lithography (Photolithography, EUV lithography, X-ray lithography, e-beam lithography etc.), etch and cleaning, CMOS process integration, back end of line processes (Copper damascene process, Metal interconnects; Multi-level metallization schemes), advanced technologies (SOI MOSFETs, Strained Si, Silic

Introduction of software: Analog design flow, digital design flow

Digital:

Design of a complex digital circuit (eg. an ALU or a multiplier) using high level h ardware description languages, logic simulation and timing simulation. Extraction of critical paths and circuit simulation of critical path sub-circuits. Circuit partitioning and realisation using FPGAs or PALs.

Analog:

Introduction: Electronic Hardware Design – Requirement and Challenges, Overview of Design tools (LTSPICE, Microcontroller usage and coding, PCB Design softwares)

Stage 1: Design, Simulation, Analysis and Implementation of a typical (analog + digital) electronic module. Realization and testing of a bread-boarded model, followed by PCB schematic design. Fabrication of PCB using etching machine. Preferably Two students in a batch

Stage 2: Execution of an electronic design case study (preferably individual projects) and demonstrate its real-time working and applications.

Overview of CMOS device fundamentals (DC Characteristics, AC Characteristics, Processing overview). CMOS inverters, Static and Dynamic characteristics, Dynamic behavior, transition time, Propagation Delay, Power Consumption. MOS Circuit Layout & Simulation, Stick diagrams, Layout design rules, MOS device layout, Transistor layout, Inverter layout, circuits layout Combinational logic, Static MOS, Complementary MOS, Ratioed logic, Pass Transistor logic, Complex logic circuits, DSL, DCVSL, Transmission gate logic. Dynamic MOS design, Dynamic logic families and their performance.

Basic MOS device. Overview of non-ideal behaviour of deep sub-micron MOS transistors. Analysis and design of current mirrors and current sources. Analysis and design of single stage amplifiers, differential amplifiers: Small signal analysis, frequency response, noise, linearity. Analysis and design of OTA circuits – differential pair, cascodes, folded-cascodes, two-stage OTAs. Stability, frequency compensation, MRR, PSRR. Feedback. Fully differential op-amps, CMFB. Bandgap references. Output stages. Switched-capacitor circuits, comparators.

Broad-stroke overview – History of Microsystem Technology with overview on commercial products, Sensing & Actuation Principles of Microsystems, Applications-MEMS Materials and Fabrication Technology Microelectronic technologies for MEMS, Micromachining Technology: Surface and Bulk Micromachining, -Design and modelling of MEMS/Microsystem: Mechanics of MEMS/Microsystems- Elasticity-Stress/strain analysis of beams, membranes etc., thin film stress-Dynamics of Microsystems MEMS Transduction Mechanisms: Optical, piezoelectric, piezoresistive, FET based transduction etc.